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3d nand harc etch

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Figure 234c shows the cross-section after staircase contact etch and hard-mask strip and clean. A-Carbon films are critical in the 3D NAND process. 3d Nand Challenges Beyond 96 Layer Memory Arrays Coventor Thickness and elastic modulus are important to define channel hole and to tune etch profile respectively Multiple metrology tools are used to comprehensively characterize this complex system PULSE Acoustic metrology provides thickness and velocity. . Receiving a substrate on a substrate support in a reaction chamber the substrate comprising the stack and a mask layer that is patterned on top of the stack wherein the stack comprises either a alternating layers of. A method of etching a feature in a stack comprising dielectric material while fabricating a 3D NAND structure the method comprising. Lam Group is exploring the next three to five years as market demand drives memory technologies towards higher density better performance new mate
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